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제품소개

SFM3

3rd Generation Smart Flip Chip Machine

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SFM3_상세.jpg

High Speed Model for Max. Productivity

· Max. UPH 19K Inline with 2 Bonders
· Highest In-class Productivity per unit area
· Single-lane or Dual-lane conveyor option

제품사양

Specifications

UPHMax. 10,000
Placement Accuracy±5 μm @ 3σ
SubstrateWidth50 ~ 330 mm (50 ~ 166 @ Dual Lane)
Length50 ~ 330 mm
Thickness0.124 ~ 4.0 mm
DieSize □0.5 ~ □32 mm
Thickness0.04 ~ 3.0 mm
Die SupplyWaferFrame Size 8” / 12” (Wafer Size 6” ~ 12”)
BumpPitchMin. 40 μm
Diameter30 ~ 500 μm
Height30 ~ 500 μm
FluxThicknessMin. 15 μm
Fluxing Accuracy±5 μm
Bond ForceMax. 30 N
UtilityElectric110/220 ~ 480 AVAC ±10% : 50 Hz, 60 Hz, 3 Phase/4 Wire
Power ConsumptionMax. 3.5 kVA
Compressed Air0.6 MPa (6 bar)/87 Psi : Consumption < 100 NI/min
Vacuum-0.085 MPa (-0.85 bar)/635 mmHg,
Average < 50 NI/h, Peak 100 NI/h
Dimension (mm)W1,681 x D1,460 x H1,430

특장점