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产品简介

DECAN F2

Advanced Flexible Placer

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DECAN系列设备可贴装元器件广泛很广,且多样化的PCB移送系统大幅提高产能。

· 确保了多种元器件处理能力及输送的灵活性
· 通过Motion Sequence的优化及设备之间共享数据缩短了生产时间
· 通过使用立体照明系统及改善强视觉算法增强了异型元器件识别能力。


Specifications

Specifications

  DECAN S2 DECAN F2DECAN L2
Alignment  Fly Camera + Fix Camera (Option)  
The Number of Spindles10 Spindle x 2 Gantry 10 Spindle x 2 Gantry6 Spindle x 2 Gantry
Placement Speed
(Optimum)
92,000 CPH (Optimum) 80,000 CPH (Optimum) 56,000 CPH (Optimum)
Placement
Accuracy
Chip ±28 μm @ Cpk ≥ 1.0
(03015 Chip)
±40 μm @ Cpk ≥ 1.0
IC ±30 μm @ Cpk ≥ 1.0
Component
Range
Fly Camera 03015 ~ □12 mm 0402 ~ □16 mm 0402 ~ □21 mm
Fix Camera ~□42 mm (Standard)
~□55 mm (MFOV)
~ L75 mm Connector (MFOV)
Max. Height 10 mm (Fly) 15 mm (Fix) 12 mm (Fly) 25 mm (Fix)
PCB Size (mm) Min. L50 x W40
Max.Single Lane ~ L510 x W460 (Standard)
~ L1,200 x W460 (Option)
~ L1,500 x W460 (Option)
Dual Lane~ L510 x W250 (Standard)
~ L510 x W280 (Option)
~ L1,200 x W250 (Option)
~ L510 x W250 (Standard)
~ L1,200 x W250 (Option)
PCB Thickness (mm) 0.38 ~ 4.2
Feeder Capacity
(8 mm 基准)
120 ea / 112 ea (Docking Cart)
Utility power 3 Phase, AC 200 / 208 / 220 / 240 / 380 / 415V ±10% (50/60 Hz)
Max. 5.0 kVA
Air
Consumption
5.0 ~ 7.0 kgf/cm2
50 Nℓ/min
Weight (kg) Approx. 1,800
External Dimension (mm) L1,430 x D1,740 x H1,485

Features