韩华精密机械

UPH		Max. 10,000
Placement Accuracy		±5 μm @ 3σ
Substrate	Width	50 ~ 330 mm (50 ~ 166 @ Dual Lane)
	Length	50 ~ 330 mm
	Thickness	0.124 ~ 4.0 mm
Die	Size	□0.5 ~ □32 mm
Die	Thickness	0.04 ~ 3.0 mm
Die Supply	Wafer	Frame Size 8” / 12” (Wafer Size 6” ~ 12”)
Bump	Pitch	Min. 40 μm
	Diameter	30 ~ 500 μm
	Height	30 ~ 500 μm
Flux	Thickness	Min. 15 μm
Flux	Fluxing Accuracy	±5 μm
Bond Force		Max. 30 N
Utility	Electric	110/220 ~ 480 AVAC ±10% : 50 Hz, 60 Hz, 3 Phase/4 Wire
	Power Consumption	Max. 3.5 kVA
	Compressed Air	0.6 MPa (6 bar)/87 Psi : Consumption < 100 NI/min
	Vacuum	-0.085 MPa (-0.85 bar)/635 mmHg, Average < 50 NI/h, Peak 100 NI/h
Dimension (mm)		W1,681 x D1,460 x H1,430

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